SI WFR 10X10 CHPS,TYPE P,PKG55

Si-chips are opaque, of low electrical resistance and have surface properties equal to glass (including smoothness). They are also good substrates for growing or mounting cells. Si-chips are precleaned before packaging. Also ideal for imaging small particles due to low background signal.

Availability: 4" wafer (#16010) is precut into 5 x 7mmm, 5 x 5mm, 10 x 10mm, 20 x 20 mm or 20 x 30mm chips that can be easily separated in the laboratory.

• 4" wafer precut into 5 x 7mm chips approximately 187 chips/wafer
• 4" wafer precut into 5 x 5mm chips approximately 270 chips/wafer
• 4" wafer precut into 10 x 10mm chips approximately 55 chips/wafer
• NEW 4" wafer precut into 20 x 20mm chips approximately 10 chips/wafer
• NEW 4" wafer precut into 20 x 30mm chips approximately 6 chips/wafer

Properties:

• Orientation: <100>
• Resistance: 1-30 Ohms
• Type: P (Boron) (1 primary flat)
• No SiO2 top coating
• Wafer thickness: 18-21 mil (460-530µm)
• Wafer is polished on one side
• Roughness: 2nm
• Before dicing they are rinsed in de-ionized water for cleaning